Finden Sie schnell ladekabel iphone magnet für Ihr Unternehmen: 2 Ergebnisse

Apple iPhone 12 Pro Graphite 128 GB 6.1 Zoll (15.5 cm) Dual-SIM iOS 14 12 Megapixel

Apple iPhone 12 Pro Graphite 128 GB 6.1 Zoll (15.5 cm) Dual-SIM iOS 14 12 Megapixel

Das iPhone 12 Pro. 5G, um riesige Dateien unterwegs zu laden und HDR Videos zu streamen. Highlights & Details - 6,1" Super Retina XDR Display (15,5 cm Diagonale) (2) - Ceramic Shield, der mehr aushält als jedes Smartphone Glas - 5G für superschnelle Downloads und Streaming in höchster Qualität (1) - A14 Bionic, der schnellste Chip in einem Smartphone - Pro Kamerasystem mit 12 MP Ultraweitwinkel‑, Weitwinkel‑ und Teleobjektiv - 5x optischer Zoombereich, Nachtmodus, Deep Fusion, Smart HDR 3 - Apple ProRAW (5), 4K Dolby Vision HDR Aufnahme - LiDAR Scanner für bessere AR Erlebnisse, Nachtmodus Porträts - 12 MP TrueDepth Frontkamera mit Nachtmodus, 4K Dolby Vision HDR Aufnahme - Branchenführender IP68 Wasserschutz (6) - Unterstützt MagSafe Zubehör zum einfachen Andocken und schnelleren kabellosen Laden (4) - iOS 14 mit neuen Widgets auf dem Homescreen, der neuen App Mediathek, App Clips und mehr
Polyimide 5000 series electrically modified /   TECASINT 5501 ESD 7

Polyimide 5000 series electrically modified / TECASINT 5501 ESD 7

POLYIMIDE WITH DEFINED ELECTROSTATIC DISSIPATIVE PROPERTIES. By modifying it with special additives, the PI plastic has a static dissipative effect and thus achieves a surface resistance of 10 E6 POLYIMIDE WITH DEFINED ELECTROSTATIC DISSIPATIVE PROPERTIES TECASINT 5501 ESD light-brown is an electrically modified polyimide based on the further development of TECASINT 5111. By modifying it with special additives, the PI plastic has a static dissipative effect and thus achieves a surface resistance of 10 E6-10 E8 ohm. The ESD material is therefore ideally suited for applications where electrostatic dissipation is to be ensured. Like all polyimide resins, TECASINT 5501 ESD light-brown is highly resistant to thermal and mechanical stress. The glass transition temperature is 329 °C and the short-term service temperature is 300 °C. In addition, the PI material is characterised by its high creep resistance. The PI Polyimide also offers a very low thermal expansion of 2.6 10-5 K-1, a high surface hardness and very good stiffness values. This makes TECASINT 5501 ESD light-brown suitable for applications in the semiconductor industry, electronics industry, cryogenics or in nuclear and vacuum technology. Furthermore, PI plastic is also resistant to high-energy radiation. TECASINT 5501 ESD light-brown is produced in the shape of polyimide sheets.